Vacuum UV Curing Device 'KNUV-1'
Increased curing treatment efficiency with UV irradiation in a vacuum environment! Supports wafering up to a maximum of 8 inches! Demonstrations and customization available!
★ Increased curing efficiency with UV irradiation in a vacuum environment! ★ Compatible with wafer sizes up to 8 inches! ★ Reduced running costs without the need for nitrogen purging! ★ Ideal for wafer processing in the manufacturing process! - By setting the oxygen concentration to a vacuum environment and applying UV irradiation, curing defects are reduced. - Voids directly under the device are also removed due to the vacuum environment. Oxygen concentration at atmospheric pressure (100,000 Pa) is approximately 20%. Oxygen concentration in the vacuum chamber of this machine (5 Pa) is 0.001%. ◇ Key Performance - Achievable pressure: Below 6.0 Pa (with gas ballast closed) - Leak rate: Below 10.0 Pa/min - Maximum pumping speed: 500 L/min using a dry pump - Build-up standard value: Converted to chamber volume as 1.0 Pa・L/sec - UV irradiation performance: Achieves short-time high-output UV irradiation by adopting high-pressure mercury lamps. Example: Cumulative light amount: 550 mJ/cm² with 27.5 seconds of irradiation. - Process time: 1 process in 60 seconds or less from the start of pumping to the completion of UV irradiation. * Pre-evaluation possible with user work! * Customizable for each user!
- Company：KNE
- Price：Other
